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Core structure and materials of flexible printed circuit boards
The structure of a flexible printed circuit board (FPC) includes a flexible substrate
2022-07-28
The structure of a flexible printed circuit board (FPC) includes a flexible substrate, conductive layer, insulating protective layer, and cover film, etc. The main materials are as follows:
1. Flexible substrate: Polyimide (PI) or polyester (PET) is usually used. PI material has better high-temperature resistance and chemical resistance, making it more suitable for equipment used in harsh environments.
2. Conductive layer: A copper foil layer is commonly used, forming conductive lines after graphic etching.
3. Cover film: To protect the surface of the circuit board and enhance durability, a protective film is usually applied, effectively preventing circuit damage and external interference.
The combination of these materials allows flexible circuit boards to not only bend but also have reliable electrical conductivity, meeting the needs of various complex circuit designs.
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