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01
Compliant with ROHS requirements,
Free of substances of very high concern (SVHC) in REACH regulations;
02
Higher thermal conductivity than ordinary aluminum-clad copper clad boards,
Effectively increasing the service life of electronic products;
03
Electromagnetic wave shielding and excellent cost performance;
04
Good machinability, excellent dimensional stability,
Contains ceramic heat dissipation filler.
Product Features
Excellent peel strength and flexibility;
Excellent cost performance;
Excellent electrical properties and insulation;
Excellent dimensional stability;
Flame retardant reaches: UL94-VO;
Excellent filling rate.
| Model/Material MATERIAL/TYPE | JRCBO207 | JRCB0307 | Industry Requirements | ||||
| Carrier Layer (um) | 55 | 55 | ±5% | ||||
| PI(um) | 5 | 7 | ±5% | ||||
| AD(um) | 7 | 7 | ±5% | ||||
| Usage Layer (um) | 12 | 14 | ±5% | ||||
| The adhesive overflow range can be adjusted according to customer requirements | |||||||
| Test Item | Property | Property | IPC Standard or Industry Requirements | ||||
| Peel Strength (kgf/cm) | 0.5 | 0.5 | ≥0.4 | ||||
| Heat Resistance | 280℃/10s Pass | 280℃/10s Pass | 280℃/10s Pass | ||||
| Dimensional Stability (Method B) | MD(%) | ±0.05 | ±0.05 | ±0.15 | |||
| TD(%) | ±0.05 | ±0.05 | ±0.15 | ||||
| Chemical Resistance | HCL 2mol/L | Peel Decline Rate(%) |
4.6 | 4.5 | ≤20 | ||
| NaOH 2mol/L | 4.5 | 4.6 | ≤20 | ||||
| IPA | 4.3 | 4.5 | ≤20 | ||||
| Inter-wire Insulation Resistance (Ω) | 89 | 90 | ≥1.0x10° | ||||
| Surface Resistance (Ω) | 4.14x1013 | 4.06x1013 | ≥1.0x10 10 | ||||
| Volume Resistance (Ω.cm) | 5.01x1014 | 5.33x1014 | ≥1.0x10 12 | ||||
| Dielectric Constant (10MHz) | 3.5 | 3.5 | ≤4.0 | ||||
| Dissipation Factor (10MHz) | 0.031 | 0.029 | ≤0.04 | ||||
| Flame Retardancy | Complies with UL94-V0 standard | Complies with UL94-V0 or VTM-0 standard | |||||
| Environmental Requirements | Complies with ROHS, REACH standards and halogen-free requirements | Complies with ROHS and halogen-free requirements | |||||
| Shelf Life | 0℃、50±20%RH | 3 months | 3 months | 3 months | |||
Ultrathin Wireless Charging Black Cover Film Series
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BEGETE 8.0W aluminum-clad copper clad laminate
Aluminum-clad copper clad laminate is a special kind of printed circuit board. Its substrate is metal (usually aluminum, copper, or other alloys), instead of the traditional epoxy fiberglass board. Metal-clad copper clad laminates are characterized by better heat dissipation performance and are mainly used in high-power lamps such as LED lighting, LED streetlights, and LED stage lighting, as well as automotive electronics and backlights.
CPI transparent substrate series
Excellent peel strength and flexibility; Excellent value for money; Excellent electrical performance and insulation; Excellent dimensional stability; Flammability rating: UL94-VO Transmittance >90%
Excellent peel strength and flexibility; Excellent value for money; Excellent electrical properties and insulation; Excellent dimensional stability; Flame retardant: UL94-VO Transmittance >90%
Ultrathin Wireless Charging Black Cover Film Series
Excellent peel strength and flexibility; Excellent value for money; Excellent electrical properties and insulation; Excellent dimensional stability; Flame retardant: UL94-VO Transmittance > 90%
Mobile:+86 19926645380
Tel：+86-756-5580028
E-mail:info@begeter.com
Address: Qianwu Town, Doumen District, Zhuhai City
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