
01
Compliant with ROHS requirements,
Free of substances of very high concern (SVHC) in REACH regulations;
02
Higher thermal conductivity than ordinary aluminum-clad copper clad boards,
Effectively increasing the service life of electronic products;
03
Electromagnetic wave shielding and excellent cost performance;
04
Good machinability, excellent dimensional stability,
Contains ceramic heat dissipation filler.
Product Features
Excellent peel strength and flexibility;
Excellent heat resistance and chemical resistance;
Good electrical performance and insulation;
Excellent dimensional stability;
Flame retardant reaches: UL94-VO;
Batch-to-batch consistency.
Model/Material MATERIAL/TYPE | JRDF0401 | JSDF0201 | Industry Requirements | ||||
PET(um) | 4 | 2 | ±5% | ||||
Cu(um) | 1*2 | 1*2 | ±5% | ||||
Usage Layer(um) | 6 | 4 | ±5% | ||||
The adhesive overflow range can be adjusted according to customer requirements | |||||||
Test Items | Property | Property | IPC Standard or Industry Requirements | ||||
Peel Strength (kgf/cm) | 0.3 | 0.3 | ≥0.2 | ||||
Heat Resistance | 210℃/10s Pass | 210℃/10s Pass | 210℃/10s Pass | ||||
Dimensional Stability (Method B) | MD(%) | ±0.08 | ±0.08 | ±0.15 | |||
TD(%) | ±0.08 | ±0.08 | ±0.15 | ||||
Chemical Resistance | HCL 2mol/L | Peel Decline Rate(%) |
4.2 | 4.3 | ≤20 | ||
NaOH 2mol/L | 4.5 | 4.6 | ≤20 | ||||
IPA | 5.2 | 5.5 | ≤20 | ||||
Inter-wire Insulation Resistance (Ω) | 4.65x1010 | 3.83x1010 | ≥1.0x10° | ||||
Surface Resistance (Ω) | 6.14x1013 | 6.06x1013 | ≥1.0x10 10 | ||||
Volume Resistance (Ω.cm) | 5.01x1014 | 5.33x1014 | ≥1.0x10 12 | ||||
Dielectric Constant (10MHz) | 3.5 | 3.5 | ≤4.0 | ||||
Dissipation Factor (10MHz) | 0.031 | 0.027 | ≤0.04 | ||||
Flame Retardancy | Complies with UL94-V0 standard | Complies with UL94-V0 or VTM-0 standard | |||||
Environmental Requirements | Complies with ROHS, REACH standards and halogen-free requirements | Complies with ROHS and halogen-free requirements | |||||
Shelf Life | 20±10℃、50±20%RH | 12 months | 12 months | 12 months |

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