
01
Compliant with ROHS requirements,
Free of substances of very high concern (SVHC) in REACH regulations;
02
Higher thermal conductivity than ordinary aluminum-clad copper clad boards,
Effectively increasing the service life of electronic products;
03
Electromagnetic wave shielding and excellent cost performance;
04
Good machinability, excellent dimensional stability,
Contains ceramic heat dissipation filler.
Product Features
Excellent peel strength and flexibility;
Excellent heat resistance (TPI adhesive layer Tg point > 180℃) and chemical resistance;
Excellent electrical performance and insulation;
Excellent dimensional stability (TPI adhesive layer CTE ≤ 22m/℃);
Flame retardant reaches: UL94-VO.
Model/Material MATERIAL/TYPE | JRCF0205 | JRCF0515 | JRCF1025 | IPC standards or industry requirements | ||||
PI(um) | 7 | 13 | 25 | ±5% | ||||
TPI(um) | 5 | 15 | 25 | ±5% | ||||
Release film(um) | 38 | 38 | 38 | ±5% | ||||
Usage layer(um) | 12 | 28 | 50 | ±5% | ||||
Adjustable according to customer requirements | Glue overflow range | |||||||
Test Item | Property | Property | Property | IPC standards or industry requirements | ||||
Peel Strength (kgf/cm) | 0.5 | 1.0 | 1.2 | ≥0.5 | ||||
Heat Resistance | 300℃/10s Pass | 300℃/10s Pass | 300℃/10s Pass | 288℃/10s Pass | ||||
Dimensional Stability (Method B) | MD(%) | ±0.05 | ±0.05 | ±0.05 | ±0.15 | |||
TD(%) | ±0.05 | ±0.05 | ±0.05 | ±0.15 | ||||
Glue overflow (mm) | 0.03~0.05 | 0.03~0.08 | 0.04~0.12 | 0.03~0.15 | ||||
Glue overflow range can be adjusted according to customer requirements | ||||||||
Chemical Resistance | HCL 2mol/L | Peel Decline Rate(%) |
3.0 | 3.4 | 3.2 | ≤20 | ||
NaOH 2mol/L | 5.4 | 5.8 | 5.3 | ≤20 | ||||
IPA | 3.2 | 3.5 | 3.3 | ≤20 | ||||
Interlaminar Insulation Resistance (Ω) | 3.85x1010 | 5.83x1010 | 4.11x1010 | ≥1.0x10° | ||||
Surface Resistance (Ω) | 5.34x1013 | 6.09x1013 | 5.16x1013 | ≥1.0x10 10 | ||||
Volume Resistance (Ω.cm) | 5.71x1014 | 5.43x1014 | 4.25x1014 | ≥1.0x10 12 | ||||
Dielectric Constant (10MHz) | 3.1 | 3.1 | 3.1 | ≤4.0 | ||||
Dissipation Factor (10MHz) | 0.014 | 0.015 | 0.014 | ≤0.04 | ||||
Flame Retardancy | Complies with UL94-V0 standard | Complies with UL94-V0 | ||||||
Environmental Requirements | Complies with ROHS, REACH standards and halogen-free requirements | Complies with ROHS and halogen-free requirements | ||||||
Shelf Life | ≤10℃、≤60%RH | 12 months | 12 months | 12 months | 12 months |

High-temperature resistant covering film series
Category
Keywords
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