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01
Compliant with ROHS requirements,
Free of substances of very high concern (SVHC) in REACH regulations;
02
Higher thermal conductivity than ordinary aluminum-clad copper clad boards,
Effectively increasing the service life of electronic products;
03
Electromagnetic wave shielding and excellent cost performance;
04
Good machinability, excellent dimensional stability,
Contains ceramic heat dissipation filler.
01
ROHS compliant,
Free of SVHCs listed in REACH regulation;
02
Higher thermal conductivity than ordinary aluminum-clad copper clad laminates,
Effectively increases the service life of electronic products;
03
Electromagnetic wave shielding and excellent cost performance;
04
Good machinability, excellent dimensional stability,
Contains ceramic heat dissipation filler.
Aluminum-clad copper clad laminate is a special kind of printed circuit board. Its substrate is metal (usually aluminum, copper or other alloys), instead of the traditional epoxy glass fiber board. The characteristic of metal-clad copper clad laminate is that it has better heat dissipation performance, mainly used in high-power lamps such as LED lighting, LED street lights, LED stage lighting, automotive electronics, backlights and other products.
| Project | Unit | Test method | Standard | Test value |
| BEGETE | ||||
| Warping |
% | IPC-TM-650 2.4.22.1 | Thickness≥0.80mm:≤2.0% Thickness≤0.80mm:≤1.5% |
0.6-1.2/0.5-1.0 |
| Dielectric layer thickness |
um | IPC-TM-650 2.2.18.1 | ±10% | ±10% |
| Thermal stress |
S | IPC-TM-650 2.4.13.1 | ≥30S | >300S |
| Peel strength (1Oz) |
N/mm | IPC-TM-650 2.4.8.1 | ≥1.0 | 1.3 |
| Withstand voltage |
KV(DC) | IPC-TM-650 2.5.6 | ≥5.0(120μmAd) | 5.0 |
| Breakdown voltage |
KV(AC) | IPC-TM-650 2.5.6 | ≥3.0(120μmAd) | 3.5 |
| Comparative Tracking Index (CTI) |
V | IEC60112 | ≥400 | 600 |
| Glass transition temperature TG(DSC) |
℃ | IPC-TM-650 2.4.25 | / | 120 |
| Coefficient of thermal expansion CTE(TMA) |
'%(50~260℃)' | IPC-TM-650 2.4.24 | ≤0.5 | 0.3 |
| Surface resistance |
MΩ | IPC-TM-650 2.5.17.1 | / | 3.96x109 |
| Volume resistivity |
MΩ·cm | IPC-TM-650 2.5.17.1 | / | 1.68x1011 |
| Insulation resistance |
Ω | JIS6481-1996 | / | 1.46x1011 |
| Dielectric constant |
/ | IPC-TM-650 2.5.5.9 | ≤6.0 | 5.8 |
| Dissipation factor |
/ | IPC-TM-650 2.5.5.9 | ≤0.045 | 0.040 |
| Water absorption |
% | IPC-TM-650 2.6.2.1 | ≤2.0 | 0.15 |
| Insulation thermal conductivity |
W/m·k | ASTM D 5470 | / | 1.55-1.80 |
| Insulation thermal resistance |
K·㎡W | / | ≤0.70x10 -4 | 0.65x10 -4 |
| Flammability |
/ | UL94 | UL94 V-0 | UL94 V-0 |
BEGETE 2.0W aluminum-clad copper clad laminate
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E-mail:info@begeter.com
Address: Qianwu Town, Doumen District, Zhuhai City
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